| const e=JSON.parse('{"key":"v-ed9f5354","path":"/zh/UserGuide/V1.1.x/IoTDB-Introduction/Scenario.html","title":"应用场景","lang":"zh-CN","frontmatter":{"title":"应用场景","order":40,"description":"应用场景 场景 1; 某公司采用表面贴装技术（SMT）生产芯片：需要首先在芯片上的焊接点处印刷（即涂抹）锡膏，然后将元器件放置在锡膏上，进而通过加热熔化锡膏并冷却，使得元器件被焊接在芯片上。上述流程采用自动化生产线。为了确保产品质量合格，在印刷锡膏后，需要通过光学设备对锡膏印刷的质量进行评估：采用三维锡膏印刷检测（SPI）设备对每个焊接点上的锡膏的体积...","head":[["link",{"rel":"alternate","hreflang":"en-us","href":"https://iotdb.apache.org/UserGuide/V1.1.x/IoTDB-Introduction/Scenario.html"}],["meta",{"property":"og:url","content":"https://iotdb.apache.org/zh/UserGuide/V1.1.x/IoTDB-Introduction/Scenario.html"}],["meta",{"property":"og:site_name","content":"IoTDB Website"}],["meta",{"property":"og:title","content":"应用场景"}],["meta",{"property":"og:description","content":"应用场景 场景 1; 某公司采用表面贴装技术（SMT）生产芯片：需要首先在芯片上的焊接点处印刷（即涂抹）锡膏，然后将元器件放置在锡膏上，进而通过加热熔化锡膏并冷却，使得元器件被焊接在芯片上。上述流程采用自动化生产线。为了确保产品质量合格，在印刷锡膏后，需要通过光学设备对锡膏印刷的质量进行评估：采用三维锡膏印刷检测（SPI）设备对每个焊接点上的锡膏的体积..."}],["meta",{"property":"og:type","content":"article"}],["meta",{"property":"og:locale","content":"zh-CN"}],["meta",{"property":"og:locale:alternate","content":"en-US"}],["meta",{"property":"og:updated_time","content":"2024-03-29T10:15:18.000Z"}],["meta",{"property":"article:modified_time","content":"2024-03-29T10:15:18.000Z"}],["script",{"type":"application/ld+json"},"{\\"@context\\":\\"https://schema.org\\",\\"@type\\":\\"Article\\",\\"headline\\":\\"应用场景\\",\\"image\\":[\\"\\"],\\"dateModified\\":\\"2024-03-29T10:15:18.000Z\\",\\"author\\":[]}"]]},"headers":[{"level":2,"title":"应用场景","slug":"应用场景","link":"#应用场景","children":[]}],"git":{"createdTime":1711707318000,"updatedTime":1711707318000,"contributors":[{"name":"CritasWang","email":"critas@outlook.com","commits":1}]},"readingTime":{"minutes":5.41,"words":1622},"filePathRelative":"zh/UserGuide/V1.1.x/IoTDB-Introduction/Scenario.md","localizedDate":"2024年3月29日","autoDesc":true}');export{e as data}; |